- Presentations by experts and panel discussions in the field of high-tech semiconductor packaging 
- Fostering semiconductor manpower and exploring directions for research cooperation and development in academic/public/private/research spheres  
 

Seoul National University of Science and Technology (SeoulTech) held a National Forum on High-tech Semiconductor Packaging in conjunction with Seoul Techno Park (Director Kihong Kim) and the Seoul Research and Development Support Foundation on Thursday, August 25th. SeoulTech is headed by University President Donghoon Lee.

In May, SeoulTech and Seoul Techno Park signed an MoU for mutual cooperation in education and research innovation in the field of semiconductor technology. This technology forum was organized as part of a cooperative venture in high-tech semiconductor packaging technology, one of the next-generation semiconductor strategic industries.

Kicking off with a lecture titled ‘The Role of Semiconductor Packaging Technology for Innovation in the Semiconductor Industry’ by Kangwook Lee, vice president of SK Hynix, the forum proceeded with ‘Advanced Packaging-based AI Semiconductors and the Need for Research Support in  Semiconductor Innovation’ by Youngsu Kwon, director of the AI SoC Research Division of Electronics and Telecommunications Research Institute (ETRI); ‘Automotive Autonomous Driving System and Electronic Packaging Technology’ by Donghyun Kim, vice president of Hana Micron; and ‘The Value of Semiconductor Packaging’ by Sayoon Kang, president of the Korean Microelectronics and Packaging Society (KMEPS). Following the presentations, participants had a chance to exchange views and explore future directions for development and cooperation between academic/public/private/research spheres.

Having established the Department of Semiconductor Engineering and the Department of Future Energy Convergence, SeoulTech has committed substantial investment and support to foster creative convergence talent to lead the era of the Fourth Industrial Revolution.